Description

Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies.

Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials now prevails in the international microelectronics industry. However, as the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.

Langue

en

Version

Couverture rigide

Date de sortie initiale

07 août 2009

Nombre de pages

423

Illustrations

Non

Personnes impliquées

Auteur principal

Tapan Gupta

Editeur principal

Springer-Verlag New York Inc.

Informations sur le fabricant

Nom du fabricant

Springer Nature Customer Service Center GmbH

Adresse du fabricant

Europaplatz 3 | 69115| Heidelberg| DE

Adresse électronique du fabricant

[email protected]

Informations sur le fabricant

Les informations du fabricant ne sont actuellement pas disponibles

Autres spécifications

Hauteur de l’emballage

35 mm

Largeur d’emballage

166 mm

Largeur du produit

155 mm

Livre d‘étude

Non

Longueur d’emballage

241 mm

Longueur du produit

235 mm

Poids de l’emballage

936 g

Police de caractères extra large

Non

Édition

2009 ed.

EAN

EAN

9781441900753

Sécurité des produits

Opérateur économique responsable dans l’UE

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Catégories

Technologie et architecture

Technologie de communication

Technologie de l’énergie

Électrotechnique

Électrotechnique

Livres

Livre, ebook ou livre audio ?

Livre

Disponibilité

Disponible à l’adresse suivante

Langue

Anglais

Type de livre

Hardcover